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World's first 12-layer HBM3E chips

유청모 / 2024-09-26 10:09:24

World's first 12-layer HBM3E chips

This photo released by SK hynix on Sept. 26, 2024, shows the 12-layer HBM3E chips. The company said it has begun mass production of the 5th-generation high-bandwidth memory product for the first time in the world. (PHOTO NOT FOR SALE) (Yonhap)

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